flip-chip
常见例句
- Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。 - As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
当电流通过焊点时,会伴随产生焦耳热效应和电迁移效应。 - A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。 - The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。 - Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
采用通用有限元软件MSC. - Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
完成某集成电路封装(叩焊芯片)内部实际的电气连接的焊料中的铅。 返回 flip-chip