multi wire-saw

基本解释

At present, the multi-wire saw has already replaced ID saw in longer ingot of semiconductor material slicing.
目前，在较长的硅单晶锭切割领域，多线切割机已基本取代内圆切片机。
The overall structure of multi-wire saw was analyzed and its work principle was explained. The realization diagram of hardware and software was given for control system.
分析了多线切割机的总体结构，说明了它的工作原理，给出了其控制系统的硬件和软件实现框图。
www.cmemo.org.cn
Multi-wire slicing is a novel method in the field of wafer slicing; recently multi-wire saw has gradually replaced the method of ID saw, and become the prevailing equipment in this domain.
多丝切割是一种新型的硅片切片加工方法，近年来多丝切割已经逐渐取代内圆切割成为硅片切片加工的主流。