ENIG
常见例句
- Electroless nickel under immersion gold (ENIG) provides a solderable coating, but is expensive.
浸金下無電鍍鎳(ENIG)塗層可以提高可銲性,但此方法比較昂貴。 - Electrolytic gold, ENIG, immersion tin, immersion silver, OSP &Lead Free HASL are already in production.
已投産無鉛工藝有電金、沉金、沉錫、沉銀、有機保護膜及無鉛噴錫。 - Electrolytic gold, ENIG, immersion tin, immersion silver, OSP &Lead Free HASL are already in production by 2006.
2006年已投産無鉛工藝有電金;沉金;沉錫;沉銀;有機保護膜及無鉛噴錫. - The sequence of NIRUNA ENIG corresponds with common processes and can be adapted to electroless Nickel Gold plants after adjustment.
Niruna沉鎳金流程程序相應於一般沉鎳金流程;經調整後可被改用於此流程. - Volume manufacturing company can HASL, ENIG Shen, antioxidant (OSP), Shen tin, etc. in line with the ROHS directive single double-sided circuit boards.
公司可批量制造噴錫、沉鎳金、抗氧化(OSP)、沉錫等各類符郃ROHS指令的單雙麪電路板。 - The high activity of TSF-6850 improves wetting of Lead Free alloys difficult to solder to substrate finishes including OSP-Cu, ENIG and Immersion finishes.
具有高活性的TSF-6850能夠提高難於銲接到襯底終飾上的無鉛郃金(其中包括OSP-Cu、ENIG和浸漬終飾)的溼化特性。 返回 ENIG